Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Abstract The thermo-mechanical reliability of IMCs (Ni 3 Sn 4 , Cu Sn, 6 5 ) solder joints and Sn-3.9Ag-0.6Cu was investigated systematically in 3D chip stacking structure subjected to an accelerated thermal cyclic loading based on finite element simulation Taguchi method. Effects different control factors, including high temperature, low dwell time loading, the stress-strain response fatigue life were calculated respectively. results indicate that maximum can be found second joint diagonal IMC array; for array, corner show obvious stress-strain, these areas are crack propagated locations. is more sensitive especially temperature; increasing time, or decreasing reduce enlarge joints. Finally, optimal design 3D-IC has combination /Cu 373 K 233 10 min time. lives under 218–398 assembly creep strain 347.4 cycles, which good agreement with experimental (380 cycles).